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66 SMT007 MAGAZINE I SEPTEMBER 2025 Associated Risks Reusing salvaged components from previously assembled printed circuit boards (PCBs) carries risks that can compromise both the reliability and safety of the final assembly. Components from old or discarded boards may have been subjected to electrical overstress, excessive thermal cycling, environmental contamination, or mechanical dam- age during prior service life. Even if the component appears physically intact, unseen degration—such as microcracks in solder terminations, weakened leads, or subtle shifts in electrical characteristics— can lead to early failure in the new product. There are several testing options to reduce the risks associated with the reuse of salvaged components. Conclusion Electronic component salvaging is more than a cost-saving strategy; it is a cornerstone of sustain- able electronics manufacturing. By reclaiming high-value components from end-of-life products, manufacturers strengthen supply chain resilience, reduce electronic waste, conserve energy, and accelerate product development cycles. Success depends on executing each stage of the process with precision. Pre-baking, controlled component removal, careful reconditioning, thorough K N O C K I N G D OW N T H E B O N E P I L E R i s k- B a s e d Te st M at r i x fo r S a l va g e d E l e ct ro n i c C o m p o n e nt s Risk Category Likelihood Severity Risk Level Key Test Actions Unknown ele ctrical histor y (over- stress, ESD, prior failure) Me d-High High C ritical 10 0% ele ctrical & function; cur ve trac e; sample burn-in 24-72h Thermal damage from prior use or removal Me dium Me d-High High V isual/microsc op e; X-ray; CSAM; sample temp cycling Moisture S ensitive Damage (MSD) High Me d-High High B aker p er MSD class; CSAM/SAM p ost-bake; THB on samples Oxidation or c ontamination of leads/balls Me dium Me dium Mo derate S olderabilit y (dip-lo ok /wet balanc e); re-tin/reball; re-test Me chanical damage (b ent pins, chipp e d package) Me dium Low-Me d Mo derate Microsc op e; c oplanarit y che ck; reje ct or rework C ounterfeit or misidentifie d parts Low-Me d High High Marking che ck; X-ray die verif y; XRF lead finish; de cap (samples) O ut-of-date or non-c ompliant (RoHS, RE ACH) Me dium Me dium Mo d-High C he ck date/markings; XRF Pb c ontent; c omplianc e verif y Latent failure risk in high- reliabilit y use Low-Me d Ver y High C ritical Full qual: burn-in, temp cycle, HTRB/ HTGB, THB, full ATE, sample destructive cleaning, and proper post-processing are all critical steps that ensure salvaged parts meet the stringent reliability requirements of modern PCB assembly. Just as important, comprehensive component testing— including electrical validation, X-ray inspection, solderability testing, and parametric verification—is vital in identifying latent defects. By confirming that salvaged parts meet performance and reliability specifications, manufacturers reduce the risk of failures that could otherwise compromise assem- bly quality or long-term field performance. Adherence to established IPC standards such as J-STD-033, J-STD-002, ANSI/ESD S20.20, and industry best practices safeguards both component integrity and operator safety. Strategic partnerships with experienced reclamation providers further enhance the reliability and efficiency of the process, ensuring that component salvaging remains a trusted, sus- tainable, and forward-looking approach to modern electronics manufacturing. SMT007 Nash Bell is president of BEST, Inc. To read past columns, click here.