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Design007-Nov2025

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20 DESIGN007 MAGAZINE I NOVEMBER 2025 B E YO N D D ES I G N by B arr y O lney, In-C ircuit D esign PT Y LTD / Australia Micro-ohm Power Delivery Network for AI-driven GPUs N V I D I A h o p p e r H 1 0 0 G P U o n SX M 5 m o d u l e. ( S o u rc e : N V I D I A ) ▼ The evolution of modern processors, marked by faster edge transitions, reduced output impedance, and increasingly complex bus architectures, has significantly augmented the demands on PCB infra- structure. These challenges are compounded by AI-driven graphics processing units (GPUs), which require exceptionally high-power delivery at ultra- low operating voltages, placing greater stress on power integrity and layout design. NVIDIA's H100/H200 GPUs, for instance, con- sume 700-1000 watts per GPU, with entire training clusters demanding multiple megawatts. To achieve this level of performance, the AC impedance of the system must be maintained in the micro-ohm range. Incorporating robust power-and-ground plane architecture allows designers to ensure sta- ble power delivery, preserve controlled impedance, and enhance electromagnetic interference (EMI) suppression, all while supporting advanced ther- mal management strategies. These capabilities are critical to achieving the reliability, performance, and scalability demanded by innovative AI systems. The power and ground planes in a high-speed, multilayer PCB perform seven crucial functions: 1. Allow the routing of controlled impedance transmission lines in both microstrip and stripline configurations. 2. Provide a reference voltage for the exchange of digital signals. 3. Distribute stable power to all logic devices. 4. Suppress crosstalk between switching signals. 5. Provide planar capacitance to decouple high frequencies. 6. Present a shield for electromagnetic radiation on internal layers. 7. Facilitate thermal dissipation of high-power- consuming devices. For all these reasons, planes are essential in today's high-speed multilayer PCBs. Unfortunately,

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