42 DESIGN007 MAGAZINE I NOVEMBER 2025
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C h e c k o u t t h e s e h i g h l i g h t s f r o m D E S I G N 0 0 7 . c o m
UHDI Fundamentals:
UHDI Technology and
Automated Inspection
Following up on the last article on inte-
grating ultra high density interconnect
(UHDI) PCB technologies and Quality
5.0, here we will do a deeper dive into
the automated inspection component. UHDI applications
demand extreme precision, with line/space dimensions
below 25 µm and microvias below 30 µm.
WestDev Announces
Advanced Thermal
Analysis Integration
for Pulsonix PCB
Design Suite
Pulsonix, the industry-leading PCB design software from West-
Dev Ltd., announced a major enhancement to its design
ecosystem: a direct interface between Pulsonix and ADAM
Research's TRM (Thermal Risk Management) analysis software.
Zuken Announces ZIW
Americas 2026 in Dallas
Zuken USA, Inc., a global leader in elec-
trical and electronic design automation,
announced Zuken Innovation World (ZIW)
Americas 2026, the company's premier
global conference dedicated to advanc-
ing the future of electrical and electronic
product design. ZIW 2026 will be held
June 9–11 in Dallas, Texas.
Quilter Secures $25M
Series B to Eliminate
Manual PCB Design With
Physics-Driven AI
Quilter, the first and only company to
publicly demonstrate fully autonomous
PCB layout through physics-driven AI,
announced $25 million in Series B fund-
ing led by Index Ventures. The invest-
ment comes as Fortune 500 aerospace,
defense, and consumer electronics com-
panies representing a $500 billion market
capitalization rapidly adopt Quilter's tech-
nology to transform how their engineering
teams design, test, and validate hardware.
Beyond Thermal Conductivity:
Exploring Polymer-based TIM
Strategies for High-power-density
Electronics
Thermal interface materials (TIMs), particularly TIM2 materi-
als, play a vital role in facilitating efficient heat transfer from
the package lid (integrated heat spreader) to a heatsink,
cold plate, or other cooling components. This article exam-
ines the underlying principles of TIM2 design and perfor-
mance, including heat
transfer mechanisms,
material chemistry, dis-
pensing techniques,
bondline control, and
long-term thermal per-
formance.
