Issue link: https://iconnect007.uberflip.com/i/1541985
18 PCB007 MAGAZINE I DECEMBER 2025 • Plasma solution: Using a specific gas mix- ture (e.g., CF₄/N₂/O₂), plasma performs nano- scale micro-etching and introduces polar functional groups, dramatically strengthening adhesion. • Industry driver: With the widespread adop- tion of high-speed materials, plasma surface treatment is critical to ensuring yield and reli- ability. What is your outlook on PCB manufacturing in the AI era? Li: AI hardware is redefining the technological boundaries of the PCB industry. Looking ahead, plasma technology will evolve from a problem-solv- ing tool into a core driver accelerating the indus- try toward high-end, high-reliability, and green manufacturing. Future development will focus on higher precision, intelligent integration, compatibil- ity with new materials, and environmentally friendly processes. Henger Microelectronics will continue invest- ing in R&D to provide the global AI industry with advanced manufacturing solutions. We've noticed growing attention on Henger's North American market strategy. Ping, what is Henger's business strategy? Ping Tang: Henger's expan- sion in North America has achieved notable progress. We've established long-term partnerships with experienced local distributors who not only understand the market but also receive full training from us, enabling them to provide comprehensive support, from equipment selection to after-sales service. Customer feedback in North America has been very positive. How is Henger performing in Southeast Asia, par- ticularly in Vietnam and Thailand? Tang: Southeast Asia is a major growth region for us. In recent years, our shipments to Vietnam and Thailand have increased significantly, driven by rapid developments in the local electronics man- ufacturing market. Demand for high-end equip- ment continues to rise, and our products, which are known for stability and efficiency, are widely recognized. As industrial upgrading accelerates in those regions, we expect continued strong growth. What market trends do you foresee in the next few years? Tang: Globally, demand for automation and intel- ligent manufacturing equipment is surging. Lever- aging our technical strengths, Henger has secured multiple large-scale orders. With the expansion of AI and advanced electronics, we anticipate more major orders, particularly from North America and Southeast Asia. North American PCB factories are moving toward unmanned production—automation. How is Henger responding? Tang: Unmanned factories are the future of manu- facturing. Henger has proactively integrated auto- mation with plasma technology, launching a range of high-efficiency, fully automated systems. These solutions improve productivity while reducing labor costs, making them highly attractive to PCB manu- facturers. With ongoing technological progress, we expect our automated equipment to play an increas- ingly important role in the North American market. We are also excited to showcase our latest inno- vations, which include a fully integrated suite combining automation with plasma processing, at the Global Electronics Association APEX EXPO in March 2026. This system embodies Henger's advancements in automation control and plasma engineering, delivering smarter and more efficient manufacturing solutions. We believe it will be a high- light of the exhibition and look forward to engaging with customers worldwide. Thank you. It has been a pleasure talking with you, and I look forward to seeing your system in person at APEX EXPO. PCB007 ⊲ AI-specific plasma etching cleaning machine.