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14 PCB007 MAGAZINE I DECEMBER 2025 F E AT U R E I N T E RV I E W BY M A R CY L A R O N T, I - C O N N ECT0 07 A rtficial intelligence is reshaping every corner of the electronics ecosystem, and PCB manufac- turing is under unprecedented pressure to evolve. In this exclusive conversation, Zhiqiang Li, general manager of Zhuhai Henger Microelectronics Equip- ment Co., Ltd., explains how plasma technology is emerging as a linchpin for next-generation AI hard- ware. As AI servers demand increasingly dense, high-performance PCBs, traditional chemical pro- cesses struggle to keep pace with new material sys- tems and tighter reliability requirements. Li explains that Henger's latest plasma etching and cleaning systems—engineered for precision, uniformity, and compatibility with advanced laminates—provide the process stability needed for the AI era. Joined by Ping Tang, vice president of business development, they explore Henger's rapid global expansion and its strategic push into automated, unmanned manufacturing. Their insights reveal a company positioning itself at the forefront of high- end, future-ready PCB production. Mr. Li and Ms. Tang, it is good to speak with you. Mr. Li, with the explosive growth of AI technologies, what new challenges is the PCB industry facing, and how are Henger's solutions addressing these changes. Zhiqiang Li: The rapid development of AI is impos- ing higher requirements on PCB manufacturing. AI servers, for example, are high-performance comput- ing units that demand multilayer, high-density inter- connect PCBs, which require strict control over dielectric properties and signal integrity. Tradi- tional chemical etching techniques can no longer meet the precision and consistency required by the hardware being designed for many AI applications. Plasma technology, with its non-contact and highly uniform processing characteristics, is emerging as a key solution. Revolutionizing PCB Manufacturing in the AI Era CESA AUGUST 2025