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@
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Cuprapulse
®
XP7-UA
for AI solutions
To find out more about Cuprapulse XP7-UA, scan the QR Code to the right.
Precision pla ng for next-genera on package substrates
Meet Cuprapulse XP7-UA , the advanced vertical reverse pulse plating (RPP) process for package sub-
strate core plating with inert anodes. Designed for next-generation applications like AI, 5G, and high-
performance computing, XP7-UA delivers exceptional copper thickness uniformity, even on panels with
c
hallenging
hole density variations. With high throwing power, increased current density, and a simple
two-additive system, it ensures superior quality, reliability, and productivity – while inert anode techno-
logy eliminates soluble anode maintenance for improved stability and reduced downtime.
Ready to achieve unmatched uniformity and throughput? Contact us today to learn how Cuprapulse
XP7-UA can optimize your core plating process.
High hole
density problem
Minimized
surface thickness gap
