DECEMBER 2025 I PCB007 MAGAZINE 69
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Driving Innovation: The Flash
Cutting Process
During the creation of a multilayer board, the
lamination process naturally results in excess
resin (known as "flash") being squeezed out
and solidified along the sides of the PCB
panel. While the consistency and size of this
flash provide process
engineers with valu-
able insight into lami-
nation parameters, the
flash itself must be com-
pletely removed before
subsequent manufactur-
ing steps.
Trouble in Your Tank:
Understanding Interconnect
Defects, Part 2
It is important to stress that a Type 2 ICD is not an
electroless copper/direct metallization/desmear
problem. The electroless deposit is firmly on the
interconnect. The electrolytic copper has sepa-
rated from the electroless copper. The root cause
of such a defect is lack of adhesion of the electro-
lytic copper to the electroless copper.
Happy Holden: Rockstar Engineer With a
Passion to Inspire the Next Generation
Happy Holden's vast knowledge, passion for the industry, and
commitment to sharing that knowledge with the next generation
is unmatched and inspiring. Happy's dedication to teaching and
making information available to the engineering community can be
found in many places, including universities, trade events, books,
and webinars.
Learning With Leo: UHDI—
The Next Leap in PCB
Manufacturing
High density interconnect (HDI) technology has
been a cornerstone of miniaturized electron-
ics since Hewlett-Packard introduced the first
chip-scale implementation in 1982. Over time,
HDI processes became central to organic flip-
chip packaging in the semiconductor industry.
Pushing Boundaries in
Measuring Board Warpage
Akrometrix is a key
player in metrol-
ogy equipment. It
focuses on accu-
rately assess-
ing warpage and
strain in PCBs and
PCBAs and pros-
pers through continuing R&D and local sourc-
ing. I recently met with Neil Hubble, president of
Akrometrix, and Paul Handler, director of sales, for
a tour of their Georgia facility.
F o r t h e l a t e s t n e w s a n d i n f o r m a t i o n , v i s i t I - C o n n e c t 0 0 7 . c o m
