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Low-temperature reflow to help eliminate HIP & bridging on large size BGAs Enhanced thermal cycle reliability in harsh conditions Reflow temperature 205–260°C Enhanced thermal cycling performance Superior voiding performance Reflow temperature 235–260°C INDIUM12.9HF OF NEXT SOLDER EVOLUTION THE indium.com ©2026 Indium Corporation Visit us at APEX, Booth 1038 Engineered for fine-pitch assemblies, delivering high transfer efficiency & superior SPI yields High oxidation resistance to eliminate graping in air reflow Low BGA, CSP, LGA, and QFN voiding