Issue link: https://iconnect007.uberflip.com/i/1543032
FEBRUARY 2026 I SMT007 MAGAZINE 21 Electronics Association: Developing the confer- ence as we've described shows that we're rein- venting ourselves for the market because we need integration of all these advances—in chips, chip- based technologies, and HI packaging. It has a direct impact on next-generation UHDI PCBs, and we know how those are assembled. So, there's a direct connection between the advances in silicon and packaging and their impact on our conven- tional attendee base in PCB and PCBA. Nolan, if we're not looking forward as we are now, then what inevitably happens is that our conven- tional base gets surprised and is unprepared for adaptation. We're reaching forward to say, "Here's what's coming, here's the impact, and here's what should matter to you." I look forward to the upcoming technology confer- ence. Do you have any closing thoughts? Welzel: I want to thank the Technical Program Committee (TPC) for their work. The team comprises 23 industry volunteers and seven association members. It is a very collaborative effort, and we are 100% on schedule, which is a notable accom- plishment. It is a great team. Rak: This is a very hands-on committee; we're doing what amounts to peer review of the abstracts, the papers, and the presentations. A TPC member is typically asked to review 10 papers and provide thoughtful feedback to the authors on how to improve or modify them. We're seeing that, as people return year after year, they're getting stron- ger at writing technical papers. Iyer: I want to acknowledge and appreciate the work done by our colleagues on the Technology Solutions team. Chris Jorgensen's work, in partic- ular, is meticulous, and his dedication and follow- up are highly appreciated. He was instrumental in bringing the conference to life; following up with all the speakers and in having all the sessions ready to deliver this March. That's a great way to end our conversation. Thank you. SMT007 of what the OEMs or final producers need and want, and that's why the expansion into design, materi- als, test, and other areas augments our base in PCB and PCBA. The caliber of speakers is very high, and their senior leadership—including the CTOs and those in charge of worldwide operations—will be in atten- dance. Beyond our core engineering speaking base, we've got higher-level technologists, and I'm really excited about it. Welzel: I am excited that high-voltage remains a strong topic at the conference. I'm looking forward to having an exchange on that. At the same time, with autonomous driving, we are moving into an era where electronics inside the car are primary to the car's operation, something we have not had before. Then there is high-performance computing and advanced substrate technologies: stacked micro- vias and embedded circuitry. Reliability will be well covered at the conference. I'm looking forward to discussing high-voltage electronics and reliability at the conference. Rak: Udo and I, both coming from the automotive industry, have been consciously trying to grow that aspect of the standards process, and the confer- ence is a good way to do that. These technical papers often serve as the basis for discussions and the adoption of new standards. I've estimated that over 30% of the submitted papers have some impact on the automotive industry, related to EV, automotive, harsh environment, or solder joint reli- ability. These things are still important to our aero- space and defense colleagues, but we've made significant strides in expanding these things as they relate to automotive electronics. There are so many traditional attendees from EMS suppliers, PCB fabrication, and design, but this is a shift in scope. Matt, what does this conference sig- nify as to where the industry is going? Kelly: I want attendees to come away with a true grasp of the rate and pace of technology that is occurring. Based on our industry experience, we know there's a lot of reinvention and innova- tion underway. The rules are changing. Roles in the ecosystem are changing. To stay competitive, companies are working hard to reinvent them- selves. We're doing the same things at the Global