Issue link: https://iconnect007.uberflip.com/i/1543032
38 SMT007 MAGAZINE I FEBRUARY 2026 Fran, you and Chris work with next-generation proj- ects. Can you share some details on the projects in process? Do you have any upcoming projects that potential volunteers or participants should consider? Fran Fourcade: There are quite a few ongoing proj- ects with next-generation standards. These are stan- dards enabling the integra- tion of new technologies, including data collection, advanced electronics pack- aging, printed electronics, plastronics, and e-textiles. All these different technolo- gies come into play, breaking through design barriers and enhancing necessary data collection mechanisms for today's interconnected world. For instance, in printed electronics, one techno- logical leap is additively manufactured electron- ics (AME), which is essentially 3D printing of PCB assemblies, as specified in the upcoming perfor- mance specification, IPC-6905. Similar technolo- gies, such as in-mold electronics (IME) and molded interconnected devices (MID), are being stan- dardized for integrating electronics into injection- molded 3D structures. An example of this is the upcoming IPC-9206, which focuses on reliability testing for 3D plastronic products, ensuring their endurance in their intended service environments. On the digital manufacturing side, data manage- ment standards widely adopted by industry for supplier declarations are being revamped into new revisions and new releases. There's a new standard on the works for sustainability data: IPC- 1783-CO2, the international standard on data collection and reporting of CO2-equivalent emis- sions, specifically tailored for the electronics manu- facturing supply chain. It's an exciting ongoing proj- ect. Furthermore, the IPC-2591 Connected Factory Exchange (CFX), the standardized language proto- col used for machine-to-machine connectivity, will soon release its new version. CFX is revised under a version cycle, more agile than our typical revision cycle, as a product of the language protocol being software-based. Additionally, new standards are being devel- oped for automated inspection process controls: IPC-9711, which will be generic requirements,; IPC-9712, for IC substrates; and a revision to IPC-9716 for board assemblies. For advanced packaging, we just released a standard on IC substrates performance acceptance, tackling some of today's most advanced manufacturing challenges. And finally, more next-generation standards are coming up shortly, for e-textiles wearables, a manufacturing technology that is gaining traction as society embraces the sensorifi- cation phenomenon. Chris Jorgensen: Building on Fran's point about the data standards, we have several task groups building out our digital manufacturing stan- dards portfolio to ensure plug-and-play interoperabil- ity for data exchange within a factory as well as through the supply chain. Working with the Supplier Declaration stan- dards task groups, which are about to release revisions of all of their standards changing from XML to J-SON, these other reporting requirements standards groups, such as IPC-1782 for traceability, IPC-1792 for cybersecurity reporting, and even the new IPC-1783-CO2E, will all utilize and build off of the IPC-175X series data envelope. This eliminates inconsistencies and redundancies in data descriptions and flows, and also enables smoother adoption for these standards within an operation. This is all being done as part of our committee's goal of enabling trusted, validated, and secure supply chains. Do you sense a shift toward forward-thinking on standards? Some of these standards sound like guidelines for technology that is still emerg- ing into wider use, which is different than the his- torical pattern of thoroughly documenting what's currently out in the field. Is the Global Electron- ics Association's standards work shifting to focus more on definition than documentation? Fourcade: Yes, that's right. From my perspective, we are keeping pace with innovation. Our stan- dards are not intended to preclude innovation in any way; they're driven by industry. So, when the industry decides that something must change, it changes. We've always looked toward the future, Fran Fourcade, Electronics Technology Standards Manager Chris Jorgensen, Senior Director, Next- Generation Standards