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68 SMT007 MAGAZINE I FEBRUARY 2026 and standards discussions, the team aims to gain deeper insight into the latest global trends in auto- mation, digitalization, and green transformation in electronics manufacturing, and to explore how these trends can be translated into practical, imple- mentable manufacturing solutions. In addition, the Mainland China team plans to visit exhibiting companies to better understand their overseas market strategies and technology devel- opment needs, with particular attention to pain points and priorities related to reliability, quality consistency, digital connectivity, and sustainability. Based on onsite solution showcases, the team will identify entry points where standards interpretation, training and certification, and technical support can facilitate implementation. After the event, a focused follow-up list of key companies and service recom- mendations will be developed to continue engage- ment and advance collaboration opportunities. Taiwan Region: Showcasing Supply Chain Capabilities With Advanced Packaging as the Core Theme The Taiwan Region team will highlight its participa- tion through the Taiwan Advanced Packaging Hub, which will serve as a central feature of Taiwan's presence at the show. Organized by the Taiwan Printed Circuit Association (TPCA), the pavilion is scheduled to make its official debut during the exhi- bition, presenting the full breadth of Taiwan's supply chain capabilities in advanced packaging and high- end PCB technologies. Represented companies will include JCET, Kinsus, Unimicron, Greymon, and Taimide Group. Under the theme,"AI Servers, Advanced Packaging, and High-end PCBs," exhibits will cover high-end PCBs, IC substrates, advanced packaging mate- rials, and process technologies, highlighting the completeness of the supply chain from materials and processes to system integration. During the exhibition, the Taiwan team will also facilitate engagement with international OEMs, EMS providers, and materials and equipment suppli- ers. Through support in standards alignment, technology trend sharing, and global industry connectivity, the team will help member companies more effectively access international markets. Japan: Participation Characterized by Standards Leadership and Technical Depth The Japan team will emphasize its contin- ued commitment to global standards development, technological innovation, and industry engagement. Hisashi Kitajima, the newly appointed Japan representative, will attend APEX EXPO for the first time, participating in technical committee meet- ings, the exhibition, and related activities. He will also engage with headquarters and other regional colleagues to discuss Japan's future development direction and growth strategy. In the area of standards, the Japan-led IPC-7-31BV- JP working group continues to advance technical proposals, with a particular focus on automotive electronics appendices related to IPC-A-610 and J-STD-001. During the conference, the team plans to share interim research findings and practical perspectives to ensure that standards more closely reflect real-world reliability and safety requirements faced by OEMs and Tier-1 suppliers. On the technical exchange and exhibition front, Taiyo Ink will present its latest research progress in advanced solder mask materials, while companies such as Japan Unix are expected to showcase laser soldering and soldering robotics solutions, demon- strating Japan's strengths in advanced interconnec- tion processes and automation applications. Korea: Deep Engagement in Global Technical Committees and Stronger Exhibitor Connectivity The Korea team will organize expert representa- tives, including regional technical committee chairs for IPC-A-610, to attend global technical commit- tee meetings for key IPC standards. These experts will engage in technical exchanges and discus- sions with international peers on critical topics such as electronics assembly reliability and acceptance criteria. During the exhibition, the team will also visit Korean exhibiting companies to understand their global market technology strategies and devel- opment needs, laying the groundwork for deeper follow-up collaboration in standards, training, and industry partnerships. In terms of technical presentations, Korean compa- nies will contribute talks based on real-world engineering challenges. Hyundai Mobis will present "Root Cause Analysis of IMS LED Module Solder Joint Reliability Based on Thermal Resistance Measurement and Finite Element Method (FEM)," sharing practical experience on how material selection and design optimization can enhance solder joint reliability and ther- mal durability under complex tempera- ture fluctuation conditions. Syd n ey X i a o