APRIL 2026 I I-CONNECT007 MAGAZINE 25
FROM THE SHOW FLOOR
Integrated Thin-film Resistive Foil
Technology
John Andresakis of Ohmega Ticer shares
his advanced solution for next-generation
PCBs, enabling miniaturization, enhanced
electrical performance, and stable resistance.
This interview explores how rising demand
for high-frequency phased-array antennas
in commercial space and military sectors is
driving the need for superior RF performance
and simplified beam forming.
Photo Chemical Systems: 50 Years
Strong
Photo Chemical Systems is celebrating 50
years in the bare board PCB market. In this
interview, David Graves and Jason Averette
discuss their expansion into assembly,
how strong relationships and a customer-
centric approach help navigate supply chain
challenges, and the innovative solutions and
growth strategies, including AI integration
and new market ventures, driving their
continued success.
Global Expansion Insights
Join Dan Beaulieu and Jimmy Fang, VP of
global development at Sunshine Global
Circuits (SGC), in this booth interview. SGC
has extensive global operations, including
its new expansion in Malaysia. Fang outlines
his company's commitment to high-tech PCB
manufacturing and shares insights into the
company's capabilities, market focus, and
future growth strategies.
