I-Connect007 Magazine

I007-Apr2026

IPC International Community magazine an association member publication

Issue link: https://iconnect007.uberflip.com/i/1544398

Contents of this Issue

Navigation

Page 59 of 121

60 I-CONNECT007 MAGAZINE I APRIL 2026 Advanced Materials Roundtable Driven largely by the need for advanced chip technology for super com- pute ability and AI applica- tions, low Dk, low-loss resin systems, and heavy copper laminate are attracting sig- nificant attention and global resources. There are numer- ous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hit- ting critical mass sooner than OEMs and fabricators think. In this roundtable discus- sion, moderator Marcy LaRont speaks with topic ex- perts: Mark Goodwin, COO of Ventec International; John Fix, senior manager of Glass Fiber Marketing at Nittobo America's Glass Fibre Research and Mar- keting division; and Ed Kelly, principal of Four Peaks Innovation and an expert consultant to material manufacturers such as Nanya. They discuss some of these dynamic material trends and what is driv- ing them, as well as examining the current state of global supply for glass and copper, and what that implies. What are manufacturers and OEMs to do? Listen and find out. Mark Goodwin, COO Mark Goodwin is Chief Operating Officer at Ventec International Group, an established leader in tech- nology and supply chain solutions, dedicated to innovative solutions in the electrical and electronic materials manufacturing industry. With over a de- cade of steering operations at Ventec International Group and extensive experience across the global laminate and PCB supply chain, he works closely with OEMs, PCB fabricators, and industry partners to support strategic material planning and long term supply chain resilience. BY M A RCY L A RO N T, I - C O N N ECT 0 07 Ed Kelley, Technology and Marketing Executive Ed Kelley is a Technology and Marketing Executive with more than 38 years of experience in printed circuits and electronic materials development and commercialization with broad functional experience in Research & Development, Process Engineering, Operations, Product Management & Marketing, New Product Introduction, Applications Engineering & Business Development. He holds extensive global ex- perience in North America, Asia, and Europe, includ- ing 9 years living in Asia. A results-driven leader with a proven track record, Ed is the author of the base material chapters of the Printed Circuits Handbook, was Chair of the iNEMI PCB & Laminate Technology Integration Group from 2020-2023, is a contributor to the iNEMI PCB & Laminate Roadmap, and 2024 re- cipient of iNEMI's Dedicated Service Award. John Fix, Senior Manager of Glass Fiber Marketing John Fix is the Senior Manager of Glass Fiber Mar- keting at Nittobo America Inc., specializing in the planning, coordination, and direction of research and marketing initiatives for Glass Fiber products. With a long tenure on the supply side of electronics manu- facturing, he is skilled in setting and achieving sales and growth goals, and developing and implementing strategic plans. PARTICIPANT BIOS LISTEN NOW!

Articles in this issue

Links on this page

view archives of I-Connect007 Magazine - I007-Apr2026