IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544398
54 I-CONNECT007 MAGAZINE I APRIL 2026 V ern Solberg is a distinguished member of the Global Electronics Association Ray- mond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementa- tion guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He's a long- time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he ad- dressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits. Marcy LaRont: Vern, it's always good to see you. You are an icon in our industry. Tell us how you got started in the electronics industry and found yourself in this wonderful place. Vern Solberg: Coming out of school, I was trained to be an industrial designer, but I couldn't find work, as the term "industrial design engineering" wasn't terribly meaningful at that time. So, I found a job as a draftsman with ITT, a communications company at Vandenberg Air Force Base. It just so happened they had an R&D facility in Palo Alto that needed help. One of the guys who was working on a new technology asked if I knew how to design printed circuit boards. I did not. He became my mentor in PCB design, and that really kicked off my career. A Designer's Focus on HIGH DENSITY Vern Solb erg F E AT U R E I N T E RV I E W BY M A RCY L A RO N T, I - C O N N ECT 0 07