IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544398
10 I-CONNECT007 MAGAZINE I APRIL 2026 From the design perspective, our contributors tackle this challenge head-on. Kelly Dack shares insights from a memorable conversation with an inventor-entrepreneur that helped shift his per- spective. Kristin Moyer explores applications that demand entirely new approaches, which may include the use of new data formats altogether (model-based data structures instead of traditional layer-based) and the growing expectation that designers understand specialty materials. Kristin notes that design may no longer follow a rulebook at all, but rather a multidisciplinary decision tree guiding successful outcomes. John Watson emphasizes that "designing for X" is no longer a solo endeavor, highlighting the es- sential role of codesign. Stephen Chavez challeng- es readers to reconsider whether the very rules that once defined success may now be holding them back. In a special APEX EXPO interview, Vern Solberg points to the inevitable shift toward HDI, UHDI, and substrate design, something he is sure today's PCB designers will be taking on. Round- ing out the section, Matt Stevenson examines advanced manufacturability through the lens of surface finishes, and the increased importance of flatness in surface finishes used in UHDI products. Anaya Vardya explores flex in advanced packag- ing, focusing on the need for standardization and current workforce challenges. Martyn Gaudion demonstrates a case study in crosshatch and how a little detective work made a big difference. When it comes to operating without a rulebook in fabrication, materials take center stage. We feature a materials roundtable discussion with experts from Ventec, Four Peaks Innovation, and Nittobo, covering everything from ongoing glass shortages to the emergence of glassless materials for high-end applications. Innovation in materials is also front and center on Jiva's recy- clable PCB substrate, a development that chal- lenges long-held assumptions about what PCBs can be. At the same time, Mike Carano offers a more measured view, emphasizing that innovation doesn't eliminate the need for fundamental under- standing. If anything, it demands a deeper grasp of core principles and closer collaboration between design and fabrication teams from the outset. Don Ball echoes this sentiment while pointing out a critical limitation: Standards simply cannot evolve quickly enough to keep pace with emerging technologies. His solution is a dedicated process development lab where new ideas can be tested without disrupting production. Elsewhere in this issue, Richard Nichols exam- ines the realities of zero liquid discharge, while Steve Williams explores the implications of the DoD canceling MIL-PRF-31032. PCBAA raises con- cerns about the fragility of U.S. PCB manufacturing capacity amid the unprecedented drawdown of munitions since the onset of the Iran war. Manfred Huschka questions whether the China Plus One strategy is still a real phenomenon. Schmoll takes a deep dive into laser drilling technologies, and we celebrate Hall of Fame recipient Karen McConnell in Dan Feinberg's ongoing series. It's another full issue, and one that proves you don't need a rulebook to move forward, only the willingness to rethink what's possible. I-CONNECT007 Marcy LaRont is the managing editor of I-Connect007 Maga- zine and executive director of IPC Publishing Group. Marcy started her career in PCBs in 1993 and brings a wide array of business experience and perspective to I-Connect007. To contact Marcy, click here. M A RCY 'S M U S I N G S " It's not about breaking rules for the sake of it, it's about recognizing when the rules no longer apply, and having the insight, collaboration, and courage to move forward anyway."