Issue link: https://iconnect007.uberflip.com/i/1545206
JUNE 2026 I SMT007 MAGAZINE 73 References 1. "SiC MOSFET reliability: Review of degradation mechanisms, failures, and enhancement strategies," by A. Abdelaleem et al., e-Prime – Nexus of Electrical, Electronic, and Intelligent Engineering, 2026. 2. "Comprehensive Review of Wide-Bandgap (WBG) Devices: SiC MOSFET and Its Failure Modes Affecting Reliability," by G. Akbar et al., Physchem, 2025. 3. "Draft Report: Wide Bandgap Power Electronics Strategic Framework," by U.S. Department of Energy, 2025. 4. "Packaging Technologies and Materials for Automotive Power Modules," by S. Behrendt, presented at IPC APEX EXPO 2025 Advanced Packaging for EV Power Electronics special session, 2025. 5. "Preventing Electric Failure of Sintered Power Module Packages," by O. Schoenfeld, IPC APEX EXPO 2025 Advanced Packaging for EV Power Electronics Special Session, 2025. 6. "Sector Spotlight: Advanced Vehicle Components," U.S. Department of Energy, 2024. 7. "Silicon Carbide in Solar Energy," U.S. Department of Energy, 2026. 8. "Reliability and Ruggedness of Commercial SiC Power MOSFETs," by L. Shi et al., Ohio State University mini- conference presentation, 2024. 9. "Thermal fatigue and failure of electronic power device substrates," by S. Pietranico, et al., International Journal of Fatigue, 2009. 10. "Reliability of Metallized Ceramic Substrates for Power Electronics Applications," by O. Mathieu, 2018. 11. Power Cycling Reliability of Power Module: A Survey," by C. Durand et al., IEEE Transactions on Device and Materials Reliability, 2016. 12. "Assessment of Electrical, Electronic, and Electromechanical (EEE) Parts Copper Wire Bonds for Space Programs," by NASA, 2023. 13. "Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods," by E. Arjmand et al. 14. "Advanced Thermal Interface Materials for Power Electronics," by S. Narumanchi et al., NREL, 2007. 15. "The Importance of Reliable Charging Station Electronics for Building a Sustainable EV Ecosystem: 'R' YOU READY?" by B. Chislea et al., Global Electronics Association, 2025. 16. "Risk Management for Per- and Polyfluoroalkyl Substances (PFAS) under TSCA," by EPA. 17. "PFAS Alternatives," EPA, 2023. 18. "Per- and Polyfluorinated Chemicals (PFAS)," OECD. 19. "ECHA supports PFAS restriction with targeted derogations," ECHA, 2026. 20. "PFAS and Alternatives in Hydraulic Oils and Lubricants," OECD, 2025. 21. "PFAS and Alternatives in Coatings, Paints, and Varnishes (CPVs)," OECD, 2022. should be treated as a function-by-function materi- als redesign exercise. The question is not, "What replaces PFAS?" but "Which PFAS function is being replaced, under what environment, with what test evidence?" That is the level at which reliable deci- sions get made. Materials Matter Because Failures Compound The broader lesson is that materials decisions do not stay confined to the materials team. They affect thermal headroom, insulation margin, switching behavior, environmental durability, manufacturabil- ity, service life, and safety. When materials are well selected and validated under realistic conditions, they deliver the benefits promised by EV platforms. When they are poorly selected or changed without enough validation, the system may still be launched, but it carries hidden life limits. On the road to EV reliability, materials are the starting point. Wide-bandgap semiconductors, ceramic substrates, advanced interconnects, TIMs, coatings, fluids, and insulation systems all matter because they determine whether the electronics can survive real voltage, heat, contamination, and real-time in service. Reliability begins with materi- als, and in EV electronics, they still decide how the story ends. SMT007 Stanton Rak is principal consultant for SF Rak Company, and co-chair of the APEX EXPO Technical Program Committee.