Issue link: https://iconnect007.uberflip.com/i/1545206
80 SMT007 MAGAZINE I JUNE 2026 S M A RT AU TO M AT I O N P CB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are sepa- rated from the panel and moved downstream for final assembly, test, or packaging. For years, manu- facturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively. However, smaller board geometries, thinner substrates, flex substrates, and edge-mounted components are increasingly pushing traditional separation methods to their limits. Here, we'll explore why PCB depaneling requirements are changing, where traditional methods still fit well, and why laser depaneling is gaining attention in modern electronics manufacturing. When Traditional Depaneling Methods Reach Their Limits BY J O S H CAS P E R , H O R I ZO N SA L ES