Issue link: https://iconnect007.uberflip.com/i/1545206
10 SMT007 MAGAZINE I JUNE 2026 BY M I K E B I X E N M A N , M AG N A LY T I X F E AT U R E A RT I C L E The demand for more functionality is less space is rapidly increasing design density in elec- tronic assemblies. Fine-pitch components, multi- layer architectures, and elevated power densities are now standard across industries ranging from automotive to medical and aerospace. While these advancements result in significant performance gains, they also introduce a less visible, but highly consequential, risk: contamination. In highly dense electronic assemblies, even microscopic flux residues can affect long-term reli- ability. Failure mechanisms that were once rare in larger geometries, such as electrochemical migra- tion (ECM), dendritic growth, and leakage currents, are increasingly common. Cleanliness is no longer a secondary process consideration, but a primary factor of product performance and durability. Highly dense assemblies are uniquely vulnerable to flux residues and contamination, which directly contribute to reliability risks. Highly dense electronic assemblies are charac- terized by a combination of miniaturization and complexity. Common attributes include: Why Cleanliness Is a Critical Reliability Driver