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JUNE 2026 I SMT007 MAGAZINE 61 follow all applicable MSD, EOS, and ESD safeguards. Component Removal After mechanical disassem- bly, most components can be recovered using hot air or infrared (IR) rework systems. Hot air systems deliver a controlled stream of heated air to raise both the compo- nent and the surrounding PCB to solder reflow temperature. Operators must carefully manage airflow, temperature, and dwell time to prevent thermal damage or PCB warping. Preheating the board before component removal is an effective practice that further reduces thermal shock and helps preserve component integrity. Infrared systems, in contrast, radiate heat directly into the component, minimizing thermal exposure to nearby devices. The technique is highly de- pendent on variables such as component color, reflectivity, and board material, making precise calibration and profiling essential. Regardless of the method used, adherence to MSD handling procedures per J-STD-033 is crucial to prevent component failure during removal, and thermal profiling ensures heating remains within manufac- turer-recommended specifications. Specialized tools and equipment are required to reliably remove and salvage electronic compo- nents from printed circuit boards. These include high-quality professional soldering irons, hot-air or infrared component removal systems, robotic hot solder dip machines, inspection systems, stereo microscopes, cleaning systems, baking ovens, and various types of hand tools. Operators performing component salvaging must be highly trained in the proper knowledge, skills, and protocols of MSD and ESD safeguards to ensure components are not damaged during the removal, desoldering, and reclamation process. Electronic component salvaging includes recla- mation of various types of primarily surface mount devices, including ball grid array, land grid array, and quad flat no-lead components, which can be salvaged and reconditioned for use in the assem- bly of other circuit boards. The harvesting of elec- tronic components from PCBs helps alleviate sup- ply chain shortages of high-value or hard-to-source electronic devices. Following reconditioning, salvaged components are typically laser-marked for traceability and packaged on tape and reel per EIA-481 standards, or in trays for automated circuit board assembly. IPC-7712, a component reclaim standard cur- rently in development, aims to advance circularity within the electronics manufacturing industry and expand the ability of component reuse as opposed to recycling of electronic waste. Conclusion Electronic waste is a worldwide problem driven in large part by consumers' desires to acquire the latest technology. It is critical to implement envi- ronmental and eco-friendly practices by advancing component-salvaging procedures. The importance of maintaining high-quality work- manship standards throughout the component reclamation process cannot be overstated. This serves to ensure the integrity of the component supply chain, facilitating environmentally respon- sible practices, and reducing reliance on energy intensive fabrication of new semiconductor devic- es and electronic components. SMT007 Nash Bell is president of BEST, Inc. To read past columns, click here. K N O C K I N G D OW N T H E B O N E P I L E Figure 2: BGA removal with hot air rework system and salvaged BGA mounted on a new PCB.