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JUNE 2026 I SMT007 MAGAZINE 83 How Laser Depaneling Technology Has Evolved A big misconception about laser depaneling is that the process simply burns through the PCB mate- rial. Years ago, that perception may have had some validity. Early laser systems were slower, generated larger heat-affected zones, and often struggled to manage certain substrate materials. Manufacturers often viewed laser depaneling as too slow, too aggressive, or too limited for broader SMT produc- tion environments. However, the technology has advanced signifi- cantly in the past decade. Modern laser depaneling systems are designed around controlled material ablation rather than brute force cutting. Instead of melting through the substrate in an aggressive pass, today's systems remove small amounts of material in multiple controlled passes. This process dramati- cally reduces thermal stress while improving overall edge quality and process consistency. The result is a much cleaner separation process with minimal discoloration, reduced carboniza- tion, and significantly smaller heat-affected zones compared to earlier generations of equipment. Speed improvements have also played a major role in broader adoption. In many applications, manufacturers now intentionally utilize multiple high-speed passes rather than a single deeper cut. While this may initially sound slower, the approach improves cut quality, reduces stress on the substrate, and creates a more stable overall process. Cost reduction has also contributed to the growing accessibility of the technology. Earlier laser depan- eling systems were often viewed as highly special- ized solutions reserved for niche applications. As laser technology has matured, equipment costs have become more approachable while improve- ments in throughput and reliability have strength- ened the overall return on investment. The reduc- tion in scrap, tooling wear, fixture requirements, and stress-related defects can significantly offset the higher upfront investment. This evolution has been particularly important for sensitive materials such as flex circuits, rigid- flex boards, thin substrates, and densely populated assemblies, where excessive heat or mechanical force can quickly create reliability concerns. As a result, laser depaneling has shifted from being viewed as a niche process into a much more practical solution for modern electronics manufac- turing environments with more board complexity and stress sensitivity. Conclusion Like any technology, laser depaneling is not the right fit for every application. Traditional routing and V-score systems still make excellent sense for many standard PCB designs, particularly in appli- cations where board materials are thick and rigid, component edge clearance is generous, produc- tion volumes are high, and stress sensitivity is low. Laser systems typically involve higher upfront investment and may introduce additional process considerations depending on material type and board construction. The key is understanding where the technology solves a meaningful manu- facturing problem. PCB depaneling requirements are evolving alongside the assemblies themselves. Laser depan- eling is gaining attention not because traditional methods have disappeared, but because modern PCB designs increasingly demand lower stress, greater precision, and improved flexibility. Josh Casper is president of Horizon Sales. To read past columns, click here. S M A RT AU TO M AT I O N