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www.atotech.com As advanced HDI and package substrate designs move toward finer lines and spaces, copper plating equipment must handle increasingly delicate panels while maintaining consistent depo- sition across complex feature geometries. In pattern-plating processes, unnecessary contact with the panel surface can damage the dry film and compromise fine-feature production. The manufacturing challenge Future-oriented substrate production requires more than a reduction in line and space. Manufacturers must process ultra- thin panels, fill blind microvias and through-holes, manage variations in panel design, and achieve uniform copper distribu- tion at production-relevant current densities. At the same time, thicker substrates and high-aspect-ratio through-holes place additional demands on mass transport and throwing power. Equipment design therefore becomes an integral part of process performance. Anode configuration, shielding, panel alignment, jig condition, and solution exchange influence the distribution of copper across the panel and within the features. A systems approach to vertical plating MKS' Atotech developed vPlate ® ICS as a vertical continuous copper plating platform for advanced HDI, SAP, (a)mSAP, and package substrate production. Its touchless transportation con- cept supports panels down to 36 µm core thickness with 2 × 2 µm copper cladding and design rules down to 8 / 8 µm line and space. The platform combines insoluble anodes with adjustable anode and cathode shielding to control copper distribution. Specially designed jigs and precise panel alignment help maintain a consistent inter-panel gap and limit edge effects. Automatic jig monitoring checks critical jig conditions, supporting process stability and increasing yield while reducing the operator work- load associated with manual inspection. vPlate ICS supports both direct-current and reverse-pulse plating. Depending on the application, it can be combined with MKS' Atotech InPro ® processes for blind-microvia and through- hole filling or with Cuprapulse ® IN for conformal plating of high-aspect-ratio through-holes. Current uniformity of ±7% and densities of up to 5 A/dm² are supported. From equipment to process control Automated loading and unloading, recipe management, para- meter monitoring, RFID-based tracking, and automated grease supply contribute to repeatable operation. By bringing together equipment, chemistry, software, and process expertise, the systems approach allows the plating line and electrolyte to be configured around the specific panel and feature requirements. Beyond installation, MKS' Atotech supports the equipment lifecycle through its global After Sales services. The Digital Factory Suite, or DFS, an IIoT software platform for equipment monitoring, traceability, notifications, and troubleshooting, complements this support. Together, these capabilities help manufacturers maintain transparency over equipment and process performance during production. In short As substrate geometries become more demanding, plating performance depends on the interaction between chemistry, equipment, automation, and panel handling. vPlate ICS provides a scalable vertical platform designed to support fine features, thin-panel processing, via filling, and high-aspect-ratio applications within one integrated production environment. Dirk Ruess Global Product Manager Equipment at MKS' Atotech dirk.ruess@mks.com +49 9128 72 56 06 vPlate ® ICS – Vertical copper plating for finer features and more demanding substrates