Issue link: https://iconnect007.uberflip.com/i/1546933
24 SMT007 MAGAZINE I OCTOBER 2026 F E AT U R E I N T E RV I E W BY N O L A N J O H N S O N , I - C O N N ECT 0 07 As automotive electronics production shifts among global locations, replicating a successful assembly process isn't as simple as moving the equipment or copying a recipe. Miles Moreau of KIC talks with Nolan Johnson about the challenges of maintaining consistent reflow perfor- mance across different lines and facilities. They explore what manufacturers can learn from better process data, where optimization can make a differ- ence, and why experienced engineers still play a critical role in getting the process right. Nolan Johnson: Miles, from your perspective, how does a manufacturer maintain product consisten- cy and reliability across facilities when automotive electronics assembly is expanded or relocated? Miles Moreau: Realigning the supply chain adds process demands because you're now trying to move a line to a factory with different equipment. It was running fine in Europe or Asia, and now it has to run the same way in Mexico or North America. Setting the line up identically probably won't be enough. Are they meeting the same process demands now that they've moved the equipment, or are they combining different equipment? These supply chain maneuvers add another layer of process complexity. When a process is duplicated at another facility, what does it take to achieve comparable perfor- mance and consistent results? You start with the process itself. One way to see the transfer challenge is through higher-power automotive assemblies, where voiding can be a key issue. These products must manage significant heat, and voids can reduce the effective heat-transfer area and increase thermal resistance. Our customers are trying to reduce the occurrence of voids, and the reflow profile is one of several factors they can work with. Vacuum reflow ovens can reduce voiding, while adjustments to ramp rate, soak, and time above liquidus may also help, depending on the solder paste, component, and assembly. The objective is a more robust and repeatable process. When you get into the process audit, you ask Building Consistent Reflow Results Across Automotive Manufacturing Sites

