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50 SMT007 MAGAZINE I OCTOBER 2026 F E AT U R E A RT I C L E BY C H R I S GASTA L D O A N D N E I L H U B B L E , A K RO M E T R I X The process of measuring BGA samples for thermal warpage is subject to industry standards from both JEDEC, in JESD22-B112C and JEITA ED7306. 1,2 Additionally, these standards establish allowable warpage values based on ball size and ball pitch, for the JEDEC standard, pass/fail further established in JEDEC SPP-024. 3 Standard practice in these standards for measuring BGA warpage is to remove the solder balls in order to measure only the substrate surface. However, as both ball size and package thickness decrease, the practicality of removing solder balls without altering the sample shape has become increasingly challenging. Determining warpage of BGAs can be challenging due to factors like surface preparation, size, or data processing. The solder balls can be physically sheared, which can potentially damage the substrate surface and alter the local surface topology. Faster BGA Warpage Processing Without Shearing or Painting Editor's note: This article is based on a paper by the authors initially presented at APEX EXPO 2025. Download the full paper at I-Connect007.com.