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OCTOBER 2026 I SMT007 MAGAZINE 49 One Platform, Full Test Coverage for Power Electronics Boards Overcoming these boundaries requires a radical architectural shift: Test equipment must combine highly flexible instrumentation, dynamic high- power sourcing, multi-domain test integration, and a handling framework that dynamically navigates around bulky components at maximum positioning precision and speed without collisions. SPEA automatic testers deliver these exact capa- bilities, providing comprehensive test coverage at maximum line speed. SPEA bed-of-nails and flying probe testers execute the entire ICT, on-board programming, and FCT sequence, incorporating advanced capabilities specifically tuned to detect defects in power electronics board assemblies. These testers effectively resolve the core set of challenges in the following ways. Deploying Flexible Instrumentation Architecture SPEA ICT bed-of-nails and flying-probe testers inte- grate high-power resources, advanced measure- ment instrumentation, and flexible architectures to perform a wide range of tests. The ICT instrumenta- tion can be configured module by module, giving it the flexibility to characterize high-power switches, magnetics, control ICs, and communication inter- faces on the same board, in the same test pass, maximizing instrumentation utilization. Simulating Real Operating Conditions Managing high power demands requires a tester capable of simulating real-world operating condi- tions through load control and perfect hardware synchronization. Traditional fragmented setups cannot handle the rapid, high-energy transients needed to replicate true field environments. SPEA eliminates these limitations with a native archi- tecture. The integrated power modules combine sources and loads to safely inject, absorb, and measure high voltage and current, stressing the board just like a real vehicle would. Maximizing Multi-domain Test Coverage By running ICT and FCT on a single station, these testers deliver comprehensive multi-domain coverage without the need for separate benches for every function. This unified platform drastically enhances defect detection by enabling optical inspection, embedded software flashing, and cali- bration on the exact same test equipment. As a result, electronics manufacturers achieve maximum validation depth within a single footprint, eliminating the fragmented hardware, extra handling, and line bottlenecks of traditional test setups. Containing Kilovolt Testing Hazards SPEA testers completely isolate extreme energy. Equipped with high-power relays, high-voltage relays, and discharge resistors they safely route high- power paths during test execution. By containing these hazards within the platform itself, these testers eliminate operator risks and ensure uncompromising safety directly on the production line. Handling Heavy Boards and Tall Components SPEA ICT bed-of-nails and flying-probe testers feature robust conveyor systems for handling large and heavy power boards, and flying-probe testers are designed to precisely navigate the PCBA with very tall components without reducing testing speed. By combining advanced mechanical capabil- ities with high-speed parallel testing, these testers satisfy strict automotive beat times, preventing physically demanding power electronics boards from becoming line bottlenecks. For automotive, where a zero-defect mandate is non-negotiable, this test equipment makes the difference between assuming a power electronic board is defect-free and proving its uncompro- mised functionality across its entire lifecycle. By combining deep application expertise with purpose-built instrumentation, SPEA helps manu- facturers achieve the quality, reliability, and cost efficiency that automotive production demands in a market where field failures carry real safety and reputational stakes, ensuring the high-power devices powering today's vehicles perform precisely as designed. Francesca Pinto works in marketing communications for Electronic and LED lighting test products at SPEA.