Issue link: https://iconnect007.uberflip.com/i/1546933
66 SMT007 MAGAZINE I OCTOBER 2026 specific qualification. MSL-1 performance and zero delamination in lead frame packages, with final moisture sensitivity and reliability performance, requires validation for the customer's specific package design and manufacturing process. Compliance Requirements Increasing U.S. and EU customers are increasingly seeking materials that address evolving PFAS requirements in major markets. The U.S. Toxic Substances Control Act (TSCA) requires certain manufacturers and importers who manufactured or imported PFAS between 2011 and 2022 to report specified information to the EPA. There are also changing requirements at the state level, as Maine and Minnesota have adopted phased restrictions on products containing inten- tionally added PFAS. This includes broader prohi- bitions scheduled for 2032, subject to exemp- tions, determinations of currently unavoidable use, and other applicable provisions. Importantly for the semiconductor industry, Maine's law includes exemptions for semiconductors, semiconductors incorporated into electronic equipment, and certain equipment and materials used in semiconductor manufacturing. These distinctions illustrate why manufacturers must evaluate PFAS requirements by jurisdic- tion and application rather than assuming a single regulatory pathway applies to the whole elec- tronics industry. Even where exemptions apply to semiconductor manufacturing, regulatory scrutiny means manufacturers must better understand the PFAS used in their operations and supply chains, including associated sourcing and documentation requirements. 7 In the EU, ECHA's Risk Assessment Committee (RAC) and Committee for Socio-Economic Analysis (SEAC) have advanced the proposed EU-wide PFAS restriction under REACH, including consideration of targeted derogations and transition measures. The European Commission, in consultation with EU Member States, will determine the final restriction following completion of ECHA's scientific evalua- tion, 8 which addresses PFAS uses across a wide range of applications, with targeted derogations considered where supported by evidence on alter- natives, costs, and benefits. 9 Materials developed with zero added PFAS may provide manufacturers with an additional option when evaluating future material, compliance, and product stewardship requirements. ATROX CD 560-1 is formulated with zero added PFAS, consistent with the product's approved tech- nical documentation. It is designed to support high- throughput manufacturing using established die- attach processing approaches. The material is compat- ible with time-pressure dispensing systems commonly Figure 2: Two die-attach cure temperature profile—a fast in-line "snap cure" ramping across seven zones in 600 seconds, and a slower "box oven" cure holding at 175°C for 60 minutes—used to set the bonding material during semiconductor assembly.