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OCTOBER 2026 I SMT007 MAGAZINE 71 Package Requirement Candidate Material Class Process Evidence Reliability Evidence Documentation Thermal load, current density, die size, bondline target, and surface finish Copper-filler paste, alternative conductive paste, hybrid sinter, silver sinter, or solder Dispense repeatability, bondline control, cure profile, voiding, bleed-out, and contamination Die shear, moisture sensitivity, delamination, thermal resistance, electrical continuity, and cycling PFAS position, substance declaration, regional status, traceability, and change control Table 2: Material-selection framework for silver-reduction programs Attribute Published Value Positioning Zero-added-PFAS copper-filled conductive die attach paste for metal lead frame packages Viscosity 10,000 cps at 25°C and 5 rpm Thixotropic index 3.6 Pot life Greater than 24 hours at 23°C Shelf life 12 months at −40°C Bulk thermal conductivity 2.5 W/mK Volume resistivity 0.0006 ohm-cm Cure options 175°C for 60 minutes in a box oven or a 10-minute snap-cure profile Representative copper die shear 13.5 kg at 25°C; 3.5 kg at 260°C Representative PPF die shear 13.0 kg at 25°C; 3.0 kg at 260°C Source: ATROX CD 560-1 Technical Data Sheet, Issue 15 July 2025. Table 3: Selected published properties for ATROX CD 560-1