Issue link: https://iconnect007.uberflip.com/i/1546933
72 SMT007 MAGAZINE I OCTOBER 2026 Stage Key Question Recommended Evidence Material screening Does the material meet thermal, electrical, rheological, storage, and cure requirements? Technical data, handling review, and compatibility screening Process development Can the line produce stable deposits and bondlines? Dispense capability, bondline measurement, void mapping, and cure profiling Package qualification Does the package survive assembly and reliability stress? Die shear, moisture sensitivity, reflow, acoustic microscopy, cross-sections, and thermal and electrical testing Production release Can performance be maintained across time, sites, and suppliers? Control plan, acceptance limits, change control, traceability, and customer documentation Table 4: Qualification checklist for alternative die attach programs Profile Type Zone / Stage Temperature Dwell Time Total Time Snap cure Zone 1 60°C — — Snap cure Zone 2 90°C — — Snap cure Zone 3 120°C — — Snap cure Zone 4 160°C — — Snap cure Zone 5 200°C — — Snap cure Zone 6 240°C — — Snap cure Zone 7 200°C — 600 sec. Box oven cure Single stage 175°C 60-minute cure hold 60 min - Additional ramp and controlled cooling required Table 5: Cure profile specifications for ATROX CD 560-1