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54 SMT007 MAGAZINE I OCTOBER 2026 Analysis Methodology BGAs were placed in an oven for 24 hours at 115 °C, prior to testing. Samples were analyzed using a thermal profile, where BGA 1 and 4 had a peak temperature of 230 °C, and BGA 2 and 3 had a peak temperature of 260 °C. Bottom surface measure- ments were performed on the Akrometrix AXP 2.0 measurement tool with a DFP 3 module, with reso- lution between 2–3 µm. Top side measurements were performed on an Akrometrix AXP 3, using a 300 lines per inch grating, with 0.5 µm resolution. All BGAs were supported on a piece of dark heat- resistant glass. Samples were tested three times each with both DFP and SM to determine if there was any kind of degradation with repeat thermal runs. The results were observed to be consistent, starting and ending with the approximately the same coplanarity values. This would indicate the peak temperature used is not high enough to alter the sample. Surface Brightness Processing of Ball Side Data Measured by DFP This method looks to remove the solder balls by identifying them based on their grayscale values. Images are 12-bit, meaning the grayscale values range from 0 to 4095, or black to white. Prior to Figure 1: Masking by pixel saturation of solder balls on BGA 1. Figure 2: Processing using feature detection (left) vs. pixel saturation (right) of BGA 1.