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12 SMT Magazine • June 2014 by gregor Langer and Markus Leitgeb, auSTria TeChnologie & SySTeMTeChnik ag Johann nicolics and Michal unger, inSTiTuTe of SenSor & aCTuaTor SySTeMS, Vienna uniVerSiTy of TeChnology Hans Hoschopf, TridoniC JennerSdorf gMbh Franz P. Wenzl, inSTiTuTe for SurfaCe TeChnologieS and phoToniCS feaTure Abstract With increasing power loss of electrical com- ponents, the thermal performance of an assem- bled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technol- ogy, particularly in the realm of high-power components, the temperature dependence of long-term reliability is a critical parameter and has to be considered with the highest possible care during the design phase. Two main drivers in the electronics indus- try are miniaturization and reliability. Whereas there is a continuous improvement concern- ing miniaturization of conductor tracks (lines/ spaces have been reduced continuously over the past years), miniaturization of the circuit carrier itself, however, has mostly been limit- ed to decreased layer counts and base material thicknesses. This can lead to significant compo- nent temperature and therewith to accelerated system degradation. Enhancement of the system reliability is di- rectly connected to an efficient thermal man- agement on the PCB level. There are several approaches which can be used to address this issue: optimization of the board-design, use of base materials with advanced thermal perfor- mance and use of innovative buildup concepts. The aim of this paper is to give a short over- view about standard thermal solutions like thick copper, thermal vias, plugged vias or met- al core-based PCBs. Furthermore, attention will be turned on the development of copper-filled Advanced Thermal Management Solutions on PCBs for High-Power Applications

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