SMT007 Magazine

June 2014 • SMT Magazine 1 EnginEEring solutions for pcb manufacturing J u n e 2 0 1 4 exploring High- Temperature Reliability Limits for Silicon Adhesives p.34 Trends in Thermal Management Materials for electronic Circuits p.48

• Cover
• Featured Content — Thermal Management
• Contents
• Column — We Saw This Coming
• Feature — Advanced Thermal Management Solutions on PCBs for High-Power Applications
• Video Interview — Ray Prasad: The Importance of IPC-7530
• Feature — Exploring High-Temperature Reliability Limits for Silicone Adhesives
• Feature — Trends in Thermal Management Materials for Electronic Circuits
• News — Mil/Aero007 News Highlights
• Article — The Trouble with BGA Solder Joints
• News — SMTonline Supplier/New Product News Highlights
• Column — Determining Testing Requirements for Components from Unauthorized Sources
• Video Interview — IPC APEX EXPO Show Wrap-up
• News — SMTonline Market News Highlights
• Column — Selecting a Stencil Frame
• I-Connect007 Panel Discussion Video — What's New in Cleaning?
• Column — Is It OK To Be Human?
• News — Top Ten News Highlights from SMTonline this Month
• Events Calendar
• Advertiser Index and Masthead