96 SMT Magazine • June 2014
a
"PeRM Council Pb-free
Research Priorities"
Released by IPC
ipC's perM Council has released a white paper
identifying priority research areas regarding the
impact and risks associated with the implementa-
tion of lead-free materials in electronics. The re-
search areas include tin whisker failure modes and
risk mitigation, complex systems logistics, and
lead-free interconnections.
b
IPC APeX eXPO Panel
Discussions: Don't Miss Them!
exploring timely issues and cutting edge technolo-
gy, these panels offer lively debate and unique per-
spectives on topics ranging from data file transfer
formats to breakthroughs in flex circuitry—and so
much more. In a small group setting, industry ex-
perts weigh in with their thoughts on business and
technical issues that you won't see anywhere else.
c
SMTA Publishes electronic
Assembly Handbook
Chapter topics include soldering and materials,
printed wiring boards, components, paste-print
stencil, component placement, assembly line de-
sign and optimization, solder reflow, wave sol-
dering, dispensing, and inspection and test. each
chapter outlines the fundamental attributes of
critical assembly processes with full-color images
and diagrams to illustrate real-world applications.
d
IPC APeX eXPO 2014
Concludes Successfully
In addition to experiencing a 14% increase in
registrations to the technical programs and near-
record participation levels in Standards develop-
ment Committee meetings, IpC apeX eXpo host-
ed a sold out exhibition: four hundred forty-three
exhibitors encompassing 137,700 net square
feet—the largest exhibition in five years.
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96 SMT Magazine • June 2014
