74 SMT Magazine • June 2014
SMTonline Supplier/new Product
news Highlights
AIM Solder Develops nC520 no Clean
Solder Pastes
nC520 is a no clean, halogen-free solder paste de-
signed for the most demanding high-density elec-
tronic assemblies. It offers excellent wetting, im-
proved printing, and reduced voiding. The solder's
wetting ability results in bright, smooth, and shiny
solder joints. Consistent transfer efficiencies reduce
head-in-pillow defects even when component/sub-
strate co-planarity is not optimal.
MyDATA Debuts new My600 Jet Printer
"we're delighted to introduce this high-performance
platform to customers struggling to mount difficult
components using classic dispenser technology or
screen printers," says robert Gothner, senior vp and
gM. "The My600 is up to 10 times faster than a dis
-
penser and, like its predecessor, shoots paste with
high precision on the fly—something no one else can
achieve."
Techspray expands Cleaner
Product Line
Techspray introduced two new defluxers into their
Techspray renew eco-dfluxer inline and batch clean
-
er product line: eco-dfluxer SMT200 and eco-dfluxer
SMT300. These new products offer increased clean-
ing performance, better metals compatibility, and re-
duced environmental impact.
nordson ASyMTeK President to Join
IPC SMeMA Council
peter bierhuis, president of nordson aSyMTek, has
been invited to join the ipC Surface Mount equip-
ment Manufacturers association Council (SMeMa).
"I have been actively involved in the electronics in-
dustry for many years and have seen the valuable role
that ipC and SMeMa play. i am looking forward to
making whatever contribution I can to the group and
the industry," said beirhuis.
ACe to Acquire gPD global's Lead
Tinning Business
"This is a major step forward for our rapidly growing
lead tinning business," said alan Cable, president of
aCe production Technologies. "The acquisition will
allow us to serve the GpD Global customer base pro
-
viding them with world-class lead tinning support to
improve their solderability, mitigate tin whiskers, and
eliminate gold embrittlement."
Techspray Intros Fine-L-Kote AR
Conformal Coating
Techspray expands their conformal coating offering
with fine-l-kote high Viscosity ar. This new prod-
uct is now a part of the company's fine-l-kote line,
which includes a wide assortment acrylic, silicone,
and urethane coatings.
Indium10.1 Offers Lowest voiding Levels
indium Corporation's indium10.1 Solder paste is a
lead-free, halogen-containing solder paste with the
lowest levels of voiding for Qfns, bgas, and pads
with large ground planes. The oxidation-inhibiting
properties of Indium10.1 promote industry-leading
head-in-pillow and graping resistance, with com
-
plete coalescence, even after long reflow profiles.
Dymax Releases new Selector guide
from conformal coatings and encapsulants to edge-
bond materials and display lamination, Dymax Cor-
poration provides innovative, solvent-free, uv light-
curing technology solutions for smart connected
device assembly. The company offers many cost-re-
ducing solutions that turn problems like shadowed
areas, cure confirmation, and production through-
put into non-issues.
Agilent Technologies Achieves
new Certification
agilent Technologies Inc. has announced that the
agilent hdMi 2.0 test solution has been certified by
the hdMi forum as an official compliance test tool.
The solution has the widest coverage for hdMi phys
-
ical layer compliance test. Certification was achieved
with the collaborative framework of panasonic; the
solution will be used at the panasonic authorized
Test Center, in osaka, japan.
Manncorp enhances Dip Soldering;
Debuts new Models
new models of Manncorp's popular auto-dip series
include features that take dip soldering technology
to new levels of performance and reliability. while
dip soldering of through-hole components has long
been an easy and affordable way to automate manu-
al soldering processes when the costs of wave solder-
ing cannot be justified, these latest enhancements
increase quality and repeatability to a degree that
make auto-dip systems ideal for virtually any short-
run, batch application.
74 SMT Magazine • June 2014
