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50 SMT Magazine • June 2014 To accomplish this, the solar and wind energy passes through a power conversion module. The circuitry must be able to handle the heat generated in the conversion process, and that is where thermal management techniques come into play. Power devices contain a metallized substrate that carries the high current through the cir- cuit with minimal losses. The substrate is not only an important component for the overall thermal performance of the electronic device, but must also provide minimal thermal resis- tance. This thermal substrate is also necessary for high mechanical and electrical reliability, and must be compatible with standard circuit manufacturing technolo- gies to help with cost competitiveness. Handling the Heat Another challenge affecting thermal man- agement applications is the push by electronic manufacturers for materials that can handle extremely high temperatures. In the past, most materials, such as those for the automobile in- dustry, were made to handle temperatures from -55°C to 150°C. Now, the OEMs are interested in designing cars with the electronics closer to the engine for better moni- toring capabilities. This means, though, that the electronic circuits will be sub- ject to hotter en- vironments near the motor. It is necessary then feaTure TRenDS In THeRMAL MAnAgeMenT MATeRIALS FOR eLeCTROnIC CIRCuITS continues figure 2: power substrate made from thick-printed copper paste.