PCB007 Magazine

May 2015 • The PCB Magazine 1 May 2015 Electroplating Through-Holes with Different Geometry: A Novel and High-Productivity Process ENEPIG: The Plating Process 22 44 Plating & Etching

• Cover
• Featured Content — Plating & Etching
• Contents
• Feature — Optimization of Acid Copper Electrodeposition Processes for High-Throwing Power DC Plating
• Video Interview — ENIG & ENEPIG IPC Standards Update
• Feature — Electroplating Through-Holes with Different Geometry: A Novel and High-Productivity Process
• News — Electronics Industry News (EIN) Market Highlights
• Feature — ENEPIG: The Plating Process
• Short — NEW Multi-Part Interview: A Conversation (and Day) with Joe Fjelstad
• News — PCB007 Supplier/New Product News Highlights
• Interview — The Importance of Harmonized Standards that Benefit All: An Interview with Amphenol's Sean Keating
• Column — Best Practices 101: Part 7
• Video Interview — Five Keys for Success in PCB Manufacturing
• News — Mil/Aero007 News Highlights
• Column — Quick-Turn Circuit Board Shops
• Top Ten Recent Highlights from PCB007
• Events Calendar
• Advertiser Index and Masthead