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34 The PCB Magazine • May 2015 Process Performance Applications using the finalized Microfill THF bath require excellent through-hole filling performance combined with good surface ap- pearance. These targets must be achieved and maintained as the bath is cycled. To evaluate aged bath performance, test panels were pro- cessed in a vertical batch pilot scale plating Table 3: Plating performance as a function of CD. Table 4: Pattern plate through-hole fill. ELECTrOPLATING THrOUGH-HOLES wITH DIFFErENT GEOMETry continues FEaturE