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16 The PCB Magazine • May 2015 Plating rack materials fabricated out of cop- per (Plastisol coated) provide more electrical conductivity than stainless steel material. This is an important fact for thicker panels and high- aspect ratio via holes. Fortunately for plating difficult circuit boards, there is another factor to consider: sec- ondary current distribution. Secondary current comes into play through a factor known as po- larization. Polarization refers to the additional potential required above the equilibrium po- tential to drive the deposition of the metal to be plated. (Keep in mind that factors involved in primary current distribution should be op- OPTIMIzATION OF ACID COPPEr ELECTrODEPOSITION PrOCESSES continues FEaturE Figure 6: influence of air versus eductors on throwing power. Figure 7: Current flux lines follow path of least resistance leading to over-plating and poor distribution.