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36 The PCB Design Magazine • July 2015 PCB007 Highlights company's recent equipment investments, and where American Standard Circuits' growth will likely come from. Being Flexible in a Rigid World With double-digit growth in the foreseeable fu- ture, flexible printed circuits (FPC), have found a tremendous niche as an enabler for various electronic applications. This trend is expected to drive the need to increase productivity while improving performance and reducing costs. Of course, in order to sell flex, one must tackle the unenviable task of metalizing these often difficult- to-plate materials. Papers Sought for IPC APEX EXPO 2016 IPC is inviting all industry professionals to submit an abstract for one of the industry's premier tech- nical conferences, or provide a course proposal for one of its largest educational events. Amphenol Invotec Accepted into the SiG Programme Europe's leading manufacturer of PCBs for criti- cal applications, is delighted to announce that it has been fully approved to be a beneficiary on the Government-backed Sharing in Growth (SiG) pro- gramme following a rigorous three-month diag- nostic process. IPC Releases N.A. PCB Industry Results for April "North American PCB sales continued slightly be- low last year's level, and orders, which rallied in the fourth quarter of 2014 and remained strong in recent months, also fell below last year's level in April," said Sharon Starr, IPC's director of market research. New IPC Report Details How PCB Makers Address Tech Trends The survey-based study shows how PCB manufac- turers are meeting today's technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment. EIPC Summer Conference, Berlin: Day 1 Berlin, Germany was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe's largest application- oriented research organisation. An Interview with Gardien Group's Jason Fraser Gardien Group CEO Jason Fraser talks to Dan Beau- lieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed. Atotech Increases Equipment Manufacturing Capacity with New Facility in China Atotech, a global leader in specialty plating chem- icals, equipment and services today announced the inauguration of its second equipment manu- facturing facility in Guangzhou, China to meet the growing demand for its plating equipment. Globally this is Atotech's third facility dedicated to manufacturing production equipment for the electronics industry. HDPUG Demonstrates Benefits of Cooperative R&D The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and in- terconnection technologies into the supply chains of its member companies. American Standard Circuits' Unique Offerings Contribute to Long-term Success At the recent IMS RF and microwave show in Phoe- nix, Arizona, Anaya Vardya, CEO of American Stan- dard Circuits, sat down with I-Connect007's Barry Matties to discuss the current market trends, the 36 The PCB Design Magazine • July 2015

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