36 The PCB Design Magazine • July 2015
PCB007
Highlights
company's recent equipment investments, and
where American Standard Circuits' growth will
likely come from.
Being Flexible in a Rigid World
With double-digit growth in the foreseeable fu-
ture, flexible printed circuits (FPC), have found
a tremendous niche as an enabler for various
electronic applications. This trend is expected
to drive the need to increase productivity while
improving performance and reducing costs. Of
course, in order to sell flex, one must tackle the
unenviable task of metalizing these often difficult-
to-plate materials.
Papers Sought for IPC APEX EXPO 2016
IPC is inviting all industry professionals to submit
an abstract for one of the industry's premier tech-
nical conferences, or provide a course proposal for
one of its largest educational events.
Amphenol Invotec Accepted into
the SiG Programme
Europe's leading manufacturer of PCBs for criti-
cal applications, is delighted to announce that it
has been fully approved to be a beneficiary on the
Government-backed Sharing in Growth (SiG) pro-
gramme following a rigorous three-month diag-
nostic process.
IPC Releases N.A. PCB Industry Results
for April
"North American PCB sales continued slightly be-
low last year's level, and orders, which rallied in
the fourth quarter of 2014 and remained strong
in recent months, also fell below last year's level in
April," said Sharon Starr, IPC's director of market
research.
New IPC Report Details How PCB
Makers Address Tech Trends
The survey-based study shows how PCB manufac-
turers are meeting today's technology demands
and looks at the changes expected by 2019 that
will affect PCB fabricators and their suppliers of
materials and equipment.
EIPC Summer Conference, Berlin: Day 1
Berlin, Germany was the venue for the 2015 EIPC
Summer Conference, which attracted delegates
from sixteen countries, including Russia, Hong
Kong, Japan, Israel, USA and Canada, as well as
the European Union, to experience a programme
of 21 technical presentations over two days. Also
included was a visit to the Berlin laboratories of
Fraunhofer Institute, Europe's largest application-
oriented research organisation.
An Interview with Gardien Group's
Jason Fraser
Gardien Group CEO Jason Fraser talks to Dan Beau-
lieu about some of the latest developments at the
company, some of the technology trends driving
the company's strategies, as well as provides his
outlook as to where the PCB industry is headed.
Atotech Increases Equipment
Manufacturing Capacity with
New Facility in China
Atotech, a global leader in specialty plating chem-
icals, equipment and services today announced
the inauguration of its second equipment manu-
facturing facility in Guangzhou, China to meet
the growing demand for its plating equipment.
Globally this is Atotech's third facility dedicated
to manufacturing production equipment for the
electronics industry.
HDPUG Demonstrates Benefits of
Cooperative R&D
The High Density Packaging User Group (HDPUG)
is a member-driven, non-profit, project-oriented
industry consortium that addresses the integration
of new electronics component packaging and in-
terconnection technologies into the supply chains
of its member companies.
American Standard Circuits' Unique
Offerings Contribute to Long-term Success
At the recent IMS RF and microwave show in Phoe-
nix, Arizona, Anaya Vardya, CEO of American Stan-
dard Circuits, sat down with I-Connect007's Barry
Matties to discuss the current market trends, the
36 The PCB Design Magazine • July 2015
