SMT007 Magazine

Because some problems you don't SEE until it's too late. ©2016 Indium Corporation Learn more: www.indium.com/avoidthevoid/SMTUS Visit us at IPC APEX, Booth 3028 AVOID VOID THE ™ AVOID: Customer Dissatisfaction. Decreased Yields. Field Failure. Experienced Engineers. Reliable Solder. Contact our technical engineers today: techsupport@indium.com

• Cover
• Featured Content — What's New?
• More Content
• Column — New Paradigms
• Short — Bridging the Bioelectronic Divide
• Feature Short — New Year Outlook: Electronics Hardware
• Short — Quantum Technology on a Chip
• Feature — High-Reliability Interconnects for High-Power LED Assembly
• MilAero007 Highlights
• Feature — EMS: Quo Vadis? (Where are you Going?)
• EIN Market Highlights
• Feature Short — Two-Print Stencil Solutions for Flip Chip/SMT Assembly
• Feature Short — Challenges and Opportunities for Smaller EMS for Onshoring
• Short — Flexible and Transparent Pressure Sensor
• Supply Lines Highlights
• Feature — Efficiency, Energy and Convenience: Driving New Solutions and Markets
• Short — Scientists Create Atomically Thin Metallic Boron
• Feature Short — Greener Cleaning
• Short — Researchers Go for the Gold on a Single Chip
• Feature Short — Magnetically Aligned Novel ACA Revolutionizes 3D Chip Stacking
• Short — Revolutionary Eye-Tracking Technology for Smart Watches
• Feature — Electrolube: We Like Problems!
• Feature — The Jefferson Project, Part 2: Automation as a Counterweight to Low Labor-Rate Assembly
• Column — Rework Site Printing using Mini Stencils—Plastic Adhesive vs. Metal
• Short — Bioinspired Technology
• Feature — Industry 4.0: Creating a Standard
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead