September 2016 • The PCB Design Magazine 59
Figure 7: Model of the package in FloTHERM 3D thermal simulation and analysis software.
Figure 9: Bad layout with nine thermal vias, and
the percentage of thermal via usage for the
0.39 W transferred by vias.
THE FUNDAMENTALS OF IMPROVING PCB THERMAL DESIGN
Figure 8: Bad layout with 15 thermal vias, and
the percentage of thermal via usage for the
0.4 W transferred by vias.
