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64 SMT Magazine • October 2017 Rehm Rigorously Inspects Electronics Components Rehm relies on the new YXLON Cheetah μHD with 3D computer tomography (CT) for components analysis. Cogiscan Signs Maxnerva Technology as Partner in Greater China Cogiscan Inc. has announced a new business part- nership with Maxnerva Technology Services Ltd as its sales and distribution partner in Greater China. Trenton Technology Upgrades to 3D AOI from Nordson YESTECH Trenton Technology has installed two of Nordson YESTECH's FX-940 ULTRA 3D AOI systems at its Uti- ca, New York facility. Vision Engineering Founder Rob Freeman Passes Away Vision Engineering Ltd announces the loss of found- er Rob Freeman, MBE, who passed away on August 19, at age 84. AIM's Flopy Feng Receives Best Presentation Award at the SMTA China South Technology Conference AIM Solder is pleased to announce that Flopy Feng, technical support engineer, received the award for Best Presentation in his technical session at the SMTA China South Technology Conference in Shenzhen, China. Heraeus Selects ASM's Mid-Speed Placement Platform for State-of-the-Art SMT Applications Lab Heraeus has selected ASM Assembly Systems' E by SIPLACE mid-speed placement platform to en- hance customer support and benchmarking initia- tives within its new Pennsylvania-based state-of- the-art SMT Applications Lab. SMART Group Launches Guide to QFN/LGA & BTC Process Defects SMART Group's latest Process Defect Photo Guide, "Guide to QFN/LGA & BTC Process Defects," will be released on October 16. Nordson VP Robert Veillette to Retire Nordson Corporation's Vice President, General Counsel and Secretary Robert E. Veillette will retire from the company after 32 years of service, effec- tive December 31, 2017. MIRTEC Europe Receives 2017 EM Best of Industry Award for AOI MIRTEC is the recipient of the 2017 Electronics Maker Best of Industry Award in the category of "Manufacturing Excellence in Automated Optical Inspection (AOI)." RTW NEPCON South China: Vermes Discusses Piezo Technology in Microdispensing During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Mi- crodispensing GmbH, discusses their latest inno- vations in microdispensing, and how their piezo technology is addressing the trend towards minia- turization in PCB assemblies. Supply Lines Highlights

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