Design007 Magazine

4 DESIGN007 MAGAZINE I JUNE 2018 Dave Wiens Discusses Multi-board Design Techniques by Andy Shaughnessy 3D Convergence of Multi-board PCB and IC Packaging Design by Bob Potock Multi-board Design with Altium's Ben jordan by Andy Shaughnessy and Stephen Las Marias Dave Discusses Design Over the past few decades, we've seen a gradual expansion of the number of multi-board electronic devices. Products are more complex now, plain and simple. There's no way that anyone could build a car, not to mention an autonomous car, with a single PCB in 2018. For our June issue, we have a variety of features that are chock-full of multi-board design information. Multi-board Design 10 20 30 JUNE 2018 • FEATURED CONTENT 20 30

• Cover: Design007 Magazine: Mulit-board Design
• Featured Content — Multi-board Design
• Additional Content
• Column — Multi-board Design: Multiple Challenges?
• Short — A Laser That Can Smell like a Hound
• Feature — Dave Wiens Discusses Multi-board Design Techniques
• Short — Light-bending Nano-patterns for LEDs
• Feature — 3D Convergence of Multi-board PCB and IC Packaging Design
• Short — Turbocharge for Lithium Batteries
• Feature — Multi-board Design with Altium's Ben Jordan
• Short — Robots Learn by Checking in on Team Members
• PCB007 Highlights
• Column — DDR3/4 Fly-by Topology Termination and Routing
• Short — Silicon Provides Means to Control Quantum Bits for Faster Algorithms
• Column — Considerations for Comparing Material Data Sheets
• Column — Thermal Management Materials: Easing the Decision-Making Process
• Short — Designing a Better Superconductor with Geometric Frustration
• MilAero Highlights
• Article — Achieving Optimum Signal Integrity During Layer Transition on High-Speed PCBs
• Top 10 Recent Highlights from Design007
• Career Opportunity Section
• Events Calendar
• Advertiser Index and Masthead
• Back Cover