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28 PCB007 MAGAZINE I MARCH 2022 would greatly boost production and effectively make producing circuit boards at lesser cost. Right now, the main hurdle to overcome is the puddle effect, but in the future, I foresee that the puddle effect will become less signif- icant. With constant efforts to get around the puddle effect and improve the topside etch uni- formity, we may get to a point where the top- side uniformity becomes better than that on the bottom side. at is when new questions will arise. If top side etch uniformity becomes the new standard, how can we improve bottom side etch uniformity? Will changes in conveyor density be enough? If it is not, what will be the new limiting factors and how can we get over- come them? PCB007 Christopher Bonsell is a chemical process engineer at Chemcut. To contact Bonsell, click here. rate, changing surface structure, spray tube flow rates, and many more. Oen, changes in what seems to be the most intuitive solution do not provide much different results. Although this puddle can be a significant obstacle, there is technology available for get- ting around it. In a future column, we will dis- cuss the different technologies available, how they compare, and in what direction these etch uniformity solutions are heading. How Can Changes in Etch Uniformity Affect PCB Manufacturing? Improvements in etch uniformity technol- ogy could be a great boost to the PCB indus- try by allowing greater output from conveyor- ized systems and reduced error in manufactur- ing. If matters like the puddle effect could be negated, producers of printed circuit boards could make panels as large as they wish. Since it is a common practice to produce multiple smaller circuits from one panel, this change Choosing the right material for your application can be a major challenge. There are "cost to perfor- mance" decisions that need to be made in order to select material that will meet the expected perfor- mance requirements and the desired cost targets. Selecting a material that meets cost targets, but fails to perform in prototype development testing, results in costly revision spins, increases cost, and results in delays to market. From the resin type, the styles and types of glass fabrics, and various types of copper foils, the reader can have a clearer picture of what to know when selecting which material is most desirable for their upcoming products. This book does not provide answers to all things laminate, but the hope is to pro- vide a solid base for making material selection deci- sions and, along the way, answer some key ques- tions. When designs require high voltage CAF perfor- mance, thermal robustness, or high-speed massive data transmission rates, laminate materials must be selected to suit your requirements for printed circuit boards. The com- ponents used to make the laminates must be studied to know the influence on these kinds of applications. This book was generated by key technical resources at Isola Group. Each of the contributing technical experts have 25–35 years of industry experience in laminate raw materials, laminate and prepreg manu- facturing, laminate material development, new prod- uct introduction, PCB fabrication, and OEM appli- cations. These individuals have contributed many years of tacit knowledge and experience, which are the basis for this book. Download this book today! BOOK EXCERPT Introduction to The Printed Circuit Designer's Guide to... High Performance Materials

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