Issue link: https://iconnect007.uberflip.com/i/1460418
4 PCB007 MAGAZINE I MARCH 2022 FEATURE ARTICLES & INTERVIEWS Uncovering the Electronics Ecosystem Interview with Will Marsh Material Applications for Mini Backlight Unit by Aaron Chen FEATURE COLUMNS How the Pandemic Impacted PCB Manufacturing by George Milad Looking at the Process of Repanelization by Happy Holden FEATURE ARTICLES & INTERVIEWS The Materials Connection Interview with Eddie Mok Improved Thermal Interface for Cooling High-power Electronics by Jeff Brandman Engineering RF Dielectric Material to Enable 5G/6G Antenna Devices by Chudy Nwachukwu Measuring Multiple Lamination Substrates for High-frequency Applications by John Strubbe Developments in Low-loss Substrates for High Frequency Applications by Alun Morgan 68 76 30 42 10 18 34 54 62 MARCH 2022 • FEATURED CONTENT In this issue, we dish on the materials research and development efforts to meet the ever- tightening relationship between the product's application and the material selected to serve as the PCB substrate. Now more than ever, material performance, availability and pricing are key factors in the specification of materials in the design phase. Materials & Technology