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20 PCB007 MAGAZINE I OCTOBER 2019 Right now, the PCB winners will be those companies who meet the needs of 5G infra- structure, automotive electronics, integrated circuit (IC) substrates, and smartphones. In- come growth in other markets will be very limited. PCB007 Yonglin Gong is a senior engineer, deputy secretary-general of the China Printed Circuit Association (CPCA), and editor-in-chief of CPCA Printed Circuit Information Magazine. Mr. Gong has served the industry for many years. Previously, Mr. Gong was chief engineer of the 20 th Shanghai Radio Factory, and he also helped translate Joseph Fjelstad's book, Flexible Circuit Technology, into Chinese. Current Outlook 2019 is the beginning of rollout and demand for 5G communications. The demand for 5G base stations, routers, servers, antennas, and other equipment will increase rapidly between 2019 and 2020. The installation of 5G commu- nications infrastructure will benefit high-level, multilayer board manufacturers, and PCB man- ufacturers who can meet such demand will en- joy a spurt of progress. Of course, automotive electronics has become an indispensable mar- ket for PCB. The computer market, though it declines a little bit, is still an important part, and smartphones still account for more than 20% of the total PCB, even if they are growing slowly. tion and power the next generation of communications devices, wearables, and displays." Kenneth Lee, senior scientific director of the SMART low-energy electronic systems (LEES) research program, adds, "With our new process, we can leverage existing capabilities to manufacture these new integrated silicon III-V chips cost-effectively and accelerate the develop- ment and adoption of new technologies that will power economies." The new technology developed by SMART builds two layers of silicon and III-V devices on separate substrates and integrates them vertically together within a micron, which is 1/50 th the diameter of a human hair. The process can use existing 200-mm manu- facturing tools, which will allow semiconductor manufacturers to make new use of their current equipment. Today, the cost of investing in new manufacturing technology is in the range of tens of billions of dollars; thus, this new IC platform is highly cost-effective and will result in much lower cost novel circuits and electronic systems. The patent portfolio has been exclusively li- censed by New Silicon Corporation (NSC) Pte. Ltd., a Singapore-based spin-off of SMART. The new in- tegrated silicon III-V chips will be available next year and expected in products by 2021. (Source: SMART) The Singapore-MIT Alliance for Research and Technol- ogy (SMART), MIT's research enterprise in Singapore, has announced the successful development of a commercial- ly viable way to manufacture integrated silicon III-V chips with high-performance III-V devices inserted into their de- sign. "By integrating III-V into silicon, we can build upon ex- isting manufacturing capabilities and low-cost volume production techniques of silicon and include the unique optical and electronic functionality of III-V technology," said Eugene Fitzgerald, CEO and director of SMART. "The new chips will be at the heart of future product innova- The Future of Chips

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