68 PCB007 MAGAZINE I OCTOBER 2019
Article by Joan Tourné
NEXTGIN TECHNOLOGY BV
Editor's Note: Click to read Part 1, Part 2, and
Part 3.
The objective of this article is to demonstrate
the possibility of using a stitching element as
an alternative to the point-to-point connections
that are used with
traditional via tech
-
nology. Point-to-point
connections have the
best performance in
terms of signal integ-
rity (one via less in
the connection that
distorts the signal).
A via is mainly a ca-
pacitive element that
causes signal loss/
dispersion.
This study focuses
on developing a lay-
er transition element
that minimises the
loss and dispersion. We will use VeCS-2 tech-
nology (blind/hybrid) construction (Figure 1).
The advantage of using a stitching via is that
we can use "traditional" orthogonal routing,
which is very efficient in signal layer utiliza-
tion. However, in some instances, orthogonal
or Manhattan routing could yield a longer trace
length, which could lead to a higher loss due
to the dielectric and conductive losses.
Vertical Conductive Structures,
Part 4: Tuning Your Signal Performance
Figure 1: Multi-level VeCS-2 technology construction.
