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68 PCB007 MAGAZINE I OCTOBER 2019 Article by Joan Tourné NEXTGIN TECHNOLOGY BV Editor's Note: Click to read Part 1, Part 2, and Part 3. The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via tech - nology. Point-to-point connections have the best performance in terms of signal integ- rity (one via less in the connection that distorts the signal). A via is mainly a ca- pacitive element that causes signal loss/ dispersion. This study focuses on developing a lay- er transition element that minimises the loss and dispersion. We will use VeCS-2 tech- nology (blind/hybrid) construction (Figure 1). The advantage of using a stitching via is that we can use "traditional" orthogonal routing, which is very efficient in signal layer utiliza- tion. However, in some instances, orthogonal or Manhattan routing could yield a longer trace length, which could lead to a higher loss due to the dielectric and conductive losses. Vertical Conductive Structures, Part 4: Tuning Your Signal Performance Figure 1: Multi-level VeCS-2 technology construction.

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