PCB007 Magazine

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• PCB007 Magazine - October 2019
• Featured Content — The Changing Landscape of the PCB Industry
• Additional Content
• Column — Asleep at the Wheel?
• Video Short — RTW SMTAI 2019: Lenora Clark Discusses Company Changes and Her New Role
• Column — Opportunities for Learning Abound at IPC
• Feature — Chinese Review: The 2018 NTI-100 Top Global PCB Fabricators
• Short — The Future of Chips
• MilAero007 Highlights
• Feature Column — The Laminate Market: What Will the Future Bring?
• Article — Multilayer Press Technology Using Magnetism to Produce Lamination Heat
• Short — Designing and 3D-printing a Better Brace
• Column — Technology and Reliability Demands Drive Designers and MIL-PRF-31032 Specification
• Electronics Industry News and Market Highlights
• Column — Additive Electronics Momentum
• Column — Via Hole Filling and Plugging, Part 2
• Supplier Highlights
• Article — Solder Mask Tack Dry
• Video Short — RTW SMTAI 2019: Company Updates and Future J-STD-001 Changes
• Article — Vertical Conductive Structures, Part 4: Tuning Your Signal Performance
• Video Short — RTW SMTAI 2019: EPTAC Continues Its Expansion
• Top 10 Editor Picks from PCB007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Info.