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84 SMT007 MAGAZINE I MAY 2021 cally insulating, heat-con- ducting dielectric layer such as the thermal con- ductive prepreg either in a typical B- or C-stage cured dielectric film. e thermal conductive prepreg consists of a glass fiber base, enriched with mineral fillers. is ther- mal interface achieves a thermal conductivity of 2.2 W/mK with dielectric strengths greater than 4 kV (70 µm dielectric) or 6 kV (100 µm dielectric thickness). Utilizing a thin film thickness (70 or 100 µm), a low ther- mal resistance (Rth) of 0.315 or 0.45 Kcm 2 /W is achieved, which efficiently dissipates the heat generated by the power components to the attached cooling element for dissipation to the ambient air. Application e main usage for the thermally conductive/elec- trical isolating silicon-free TIM dielectric is in power electronics, where the best compromise of heat trans- fer combined with electri- cal isolation is essential. is heat transfer is suc- cessfully utilized, for exam- ple, in electronic power modules controlling solar inverters, windmills, and industrial LED ligh- ting. It is also used in industrial power electro- nics, in welding machines, and robot drives. Future projects are increasingly being identi- fied in electric vehicles (EV) for power train and on-board-charger applications. A key task of the film is to efficiently dissi- pate heat with maximum insulation dielec- tric strength in order to optimally connect power MOSFETs to the liquid-cooled micro-co- olers from IQ-evolution. Extensive tests have proven that for this parti- Figure 2: Schematic of a cooling system in power electronics, using the example of an IMS power board, coupled to an aluminum heat sink via TIM. (Source: Aismalibar) Figure 3: Application example of a liquid-cooled, highly compact MOSFET assembly for power electronics. (Source: IQ Evolution)