SMT007 Magazine


Issue link:

Contents of this Issue


Page 9 of 119

Special Section: IPC Semiconductor Packaging Gap Analysis Report In November 2021, IPC released a study detail- ing the current state of advanced semiconductor packaging in North America. In announcing the report, IPC stated that the study "is a thorough, data-driven analysis of the global semiconductor and advanced packaging ecosystem." In its entirety, this 100+ page report, IPC explained that it "makes the case for congressional appro- priations of more than $50 billion to support U.S. semiconductor manufacturing, while also underscoring the need to expand advanced packaging capabilities to support the increased production of chips." In this special section, we've received permission to reprint IPC's report summary in its entirety.

Articles in this issue

Archives of this issue

view archives of SMT007 Magazine - SMT007-Mar2022